hewlett-packard UNITED STATES
Skip site-wide navigation link group hewlett-packard home products and services support solutions how to buy
hewlett-packard logo with invent tag line - jump to hp.com home page
End of site-wide navigation link group
 
printable version
hp journal online
hp labs skip lorem ipsum dolor navigation menu link group
search
contact hp
in this issue
table of contents
about the cover
what's ahead
online issues
hp journal home
hp labs home
about hp labs
research
news and events
careers @ labs
technical reports
worldwide sites
end of lorem ipsum dolor navigation menu link group
go to article skip lorem ipsum dolor navigation menu link group
1 2 3 4 5
6 7 8 9 10
11 12
end of lorem ipsum dolor navigation menu link group
December 1997, Article 10

December 1997, Article 10

Flip-Chip Photodetector for High-Speed Communications Instrumentation

A family of 7-GHz-bandwidth optical receivers and a nine-channel optical receiver with a gigabit-per-second data rate per channel have been developed for multigigabit lightwave test systems for long-haul fiber-optic telecommunications links and gigabit optical interconnects for computer systems. A new micro-flip-chip process, featuring liftoff-based small-diameter solder bumps, is incorporated with HP high-speed InP p-i-n photodetectors to minimize parasitic capacitance and inductance and enhance responsivity.

by Tun S. Tan, David M. Braun, Tim L. Bagwell, Chris Kocot, Joseph Straznicky, and Susan R. Sloan


Article 10 - dec97a10.pdf


This article is available in Adobe Acrobat format (PDF). To view this article you need to have Acrobat Reader 2.0 or later installed on your system. The Acrobat reader is available free of charge in Unix, Dos, Windows and Macintosh formats. You can download the reader from Adobe Systems (www.adobe.com)
Skip page footer
printable version
privacy statement using this site means you accept its terms © 1994-2002 hewlett-packard company
End of page footer