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Assessment of Low-Temperature Fluxes
The subject of this paper is the evaluation of the wetting balance as a technique for studying the flux activity of newly developed low-temperature solder paste fluxes. The most effective configuration of the wetting balance was the standard configuration with only one change: the PbSn eutectic solder was replaced with a eutectic solder alloy with a melting point of 585C. Since 585C is significantly less than the proposed activation temperatures of the solder fluxes, wetting curves as a function of temperature could be studied for each of the fluxes. The resulting data was used to rank the fluxes in terms of their activation requirement.
by Hubert A. Vander Plas, Russell B. Cinque, Zequn Mei, and Helen Holder
 Article 11 - aug96a11.pdf
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