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Reliability Enhancement of Surface Mount Light-Emitting Diodes for Automotive Applications
Preencapsulation drying eliminates broken stitch bonds and reduces inconsistent reliability performance. A new casting epoxy formulation stops epoxy cracking, and optimization of the die-attach epoxy cure schedule solves lifted die-attach and delamination problems.
by Koay Ban-Kuan, Leong Ak-Wing, Tan Boon-Chun, and Yoong Tze-Kwan
 Article 8 - aug98a8.pdf
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